Chip MCU cover opening (unsealing) service

In order to identify whether the MCU is counterfeit and renovated, and to verify the localization of the chip.

Open the packaging materials to observe the internal chips, whether metal or ceramic sealing or plastic packaging devices, whether monolithic integrated devices
(DIP, SOT, SOP, QFP, QEN, PLCC, BGA, CSP * EJ) or multi chip hybrid module (MCM), system level package (SIP), plastic packaging, ceramic flip chip (FC) or formal device, chip on board (COB package), GaAs, GaN devices can be opened.
It can also carry out experiments and evaluation services related to the reliability of electronic components such as chip chemical peeling (passivation layer removal, metal layer removal), failure analysis, etc.

Chemical open package

open chip

Use chemical reagents such as fuming nitric acid and concentrated sulfuric acid to remove packaging materials through chemical reaction.

Observation and penetration line

Observation and penetration line

Copy the internal circuit diagram

Chemical open package

Special packaging chip

Special packaging chip

Stack die chip

Stack DIE chip